Products and Services
We offer a wide range of PCB products including conventional PCBs, HDI PCBs, flexible PCBs, rigid-flex PCBs, backplane assemblies, and IC substrates. We also offer value-added services to support our customers' needs.
TTM services also include Electro-Mechanical Solutions (E-MS). Our products in this area include sheet metal design and fabrication, backplane assembly, system integration, test and logistics for a complete solution supporting sub-system and full system integration requirements.
Printed Circuit Board Fabrication
Conventional PCB
- Multilayer up to 60+ layers
- Embedded passives
- Heavy copper up to 10 oz.
- Over 50 UL approved laminates
- Thickness up to 0.450"
- Thin core dielectrics
- Dimensions up to 30" x 54"
- Mixed dielectrics
HDI
- Up to 12L "anylayer" stacked uVia Structure
- 1.6 / 2.0 mil line / space
- Wide material and surface finish selections
- 14 mil, 6L ultra thin structure
- 3/7 mil uVia / Pad size
- 0.4 mm pitch BGA with 2 traces fanout
- Embedded, distributed and discrete passive components
Flex & Rigid-Flex
- Type 2, 3 and 4 (double sided, multilayer and rigid-flex)
- 30+ layers
- Dimensions up to 24" x 48"
- Acrylic, epoxy and adhesive-less polyimide flex materials
- Over 50 rigid material options
- Thickness up 0.300"
- Bikini cut, bookbinder and loose leaf construction
- Combination surface finishes
- Epoxy fillet
RF & Microwave
- High frequency / bandwidth designs
- Planar and screened resistors
- Dimensions up to 24" x 48"
- Mixed dielectrics (hybrids)
- Dielectric foam
- Conductive paste
- Plated cavities
- Formed (conformal) PCBs
- Optical machining
Thermal Management
- Passive and active designs
- Buried metal core constructions
- Externally mounted heatsinks
- Epoxy and B-stage films
- Thermal & conductive bonding
- Aluminum & copper base materials
- Various surface finishes
- In-house milling and bonding
IC Substrate
- 2,4,6 Layers (2+2+2 stacked via)
- BT material
- Wire bonding (ENEPIG, Soft gold, Hard gold)
- Type: SIP,CSP,BOC & FC package
- Fine trace width/space 25/25um
- Thin board: 130um(2L), 170um(4L)
- Flip chip C4 pad
Custom Assembly
Backplanes
- Dimensions up to 28" x 52"
- Thickness up to 0.400"
- Custom and Industry Standard
- Press-fit (compliant a€“pin)
- Surface mount (chip, QFP, BGA)
- Wave / selective solder
- AOI & X-ray inspection
- Level 2, 3 & 4 testing
- Conformal coating
Flex & Rigid-Flex
- Dimensions up to 22" x 52"
- Passive & active components
- Press-fit (compliant-pin)
- Surface mount (chip, QFP, BGA)
- AOI & X-ray inspection
- Level 2,3, & 4 testing
RF & Microwave
- Dimensions up to 22" x 34"
- Blind via, surface mount, thru-hole
- 1-piece hermetic GPO and GPPO
- X-ray inspection
- RF testing (20+ GHz)
Integrated Assembly
- Card cage through cabinet
- Backplanes & Midplanes
- Harnessing & cabling
- Power supplies & fan trays
- Peripherals & controllers
- I/O interfaces
- Functional testing
- Mil & Aero conduction cooled