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            Products and Services

            We offer a wide range of PCB products including conventional PCBs, HDI PCBs, flexible PCBs, rigid-flex PCBs, backplane assemblies, and IC substrates. We also offer value-added services to support our customers' needs.

            TTM services also include Electro-Mechanical Solutions (E-MS). Our products in this area include sheet metal design and fabrication, backplane assembly, system integration, test and logistics for a complete solution supporting sub-system and full system integration requirements.

            Printed Circuit Board Fabrication

            Conventional PCB

            • Multilayer up to 60+ layers
            • Embedded passives
            • Heavy copper up to 10 oz.
            • Over 50 UL approved laminates
            • Thickness up to 0.450"
            • Thin core dielectrics
            • Dimensions up to 30" x 54"
            • Mixed dielectrics

            HDI

            • Up to 12L "anylayer" stacked uVia Structure
            • 1.6 / 2.0 mil line / space
            • Wide material and surface finish selections
            • 14 mil, 6L ultra thin structure
            • 3/7 mil uVia / Pad size
            • 0.4 mm pitch BGA with 2 traces fanout
            • Embedded, distributed and discrete passive components

            Flex & Rigid-Flex

            • Type 2, 3 and 4 (double sided, multilayer and rigid-flex)
            • 30+ layers
            • Dimensions up to 24" x 48"
            • Acrylic, epoxy and adhesive-less polyimide flex materials
            • Over 50 rigid material options
            • Thickness up 0.300"
            • Bikini cut, bookbinder and loose leaf construction
            • Combination surface finishes
            • Epoxy fillet

            RF & Microwave

            • High frequency / bandwidth designs
            • Planar and screened resistors
            • Dimensions up to 24" x 48"
            • Mixed dielectrics (hybrids)
            • Dielectric foam
            • Conductive paste
            • Plated cavities
            • Formed (conformal) PCBs
            • Optical machining

            Thermal Management

            • Passive and active designs
            • Buried metal core constructions
            • Externally mounted heatsinks
            • Epoxy and B-stage films
            • Thermal & conductive bonding
            • Aluminum & copper base materials
            • Various surface finishes
            • In-house milling and bonding

            IC Substrate

            • 2,4,6 Layers (2+2+2 stacked via)
            • BT material
            • Wire bonding (ENEPIG, Soft gold, Hard gold)
            • Type: SIP,CSP,BOC & FC package
            • Fine trace width/space 25/25um
            • Thin board: 130um(2L), 170um(4L)
            • Flip chip C4 pad

            Custom Assembly

            Backplanes

            • Dimensions up to 28" x 52"
            • Thickness up to 0.400"
            • Custom and Industry Standard
            • Press-fit (compliant a€“pin)
            • Surface mount (chip, QFP, BGA)
            • Wave / selective solder
            • AOI & X-ray inspection
            • Level 2, 3 & 4 testing
            • Conformal coating

            Flex & Rigid-Flex

            • Dimensions up to 22" x 52"
            • Passive & active components
            • Press-fit (compliant-pin)
            • Surface mount (chip, QFP, BGA)
            • AOI & X-ray inspection
            • Level 2,3, & 4 testing

            RF & Microwave

            • Dimensions up to 22" x 34"
            • Blind via, surface mount, thru-hole
            • 1-piece hermetic GPO and GPPO
            • X-ray inspection
            • RF testing (20+ GHz)

            Integrated Assembly

            • Card cage through cabinet
            • Backplanes & Midplanes
            • Harnessing & cabling
            • Power supplies & fan trays
            • Peripherals & controllers
            • I/O interfaces
            • Functional testing
            • Mil & Aero conduction cooled
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