<sub id="99l19"></sub>

      <form id="99l19"><form id="99l19"><nobr id="99l19"></nobr></form></form>

          
          

            <form id="99l19"></form>
            <form id="99l19"></form>
            Menu
            TTM Products
            Skip Navigation LinksHome > Products & Services > RF & Microwave PCBs
            Print

            RF & Microwave PCBs

            TTM applications based approach provides innovative engineering and advanced process capabilities.

            From defense/aerospace electronics, medical devices and imaging, or complex telecommunications equipment, TTM supports a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W). We have extensive experience with a wide range of low loss laminates and a total of over 70 resin systems.

            Our Field Applications Engineering team provides a long history of collaborative engineering support. Qualifications include MIL-PRF-31032, AS 9100, ITAR, IPC 6012 & IPC6018, NADCAP.

            Our Capabilities Include:

            Tight Etch Tolerances on Critical RF Features

            • +/- .0005" standard tolerance on etched features for unplated 0.5oz copper
            • Selective plated up layers allowing +/- .0005" etch tolerances
            • Exact registration/laser direct imaging
            • Front to back registration of etched cores to +/-.001"
            • Mixed Dielectric constructions
            • Buried / Blind / Microvia
            • Ormet interconnects
            • Multilevel cavity constructions
            • Optical mill / drill
            • Laser routing
            • Sequential lamination
            • Formed PCB'S
            • Plated edges

            Back Drill for Precision Stub Removal

            • Mechanical back-drilling (Minimal stub)
            • Laser drilling (No stub)
            • Laser modified controlled depth drill (Mechanical drill followed by laser cleanup, no stub)

            Hole Fill

            • Conductive, nonconductive, and partial hole fill options

            Thermal Solutions

            • Copper coins and slugs
            • Metal Core & Metal Back
            • Thermally conductive laminates
            • Heatsink assembly department to laminate heatsink or interface plates to the circuit boards

            Embedded Capabilities

            • Planar Resistors
              • Ohmega and Ticer
              • Screened Ink Resistors
            • Circulators
              • On board circuit
              • Embedded ferrites

            Surface Finishes

            • ENIG – electroless nickel, soft immersion gold – standard solder assemblies
            • ENEPIG - electroless nickel, electroless palladium, immersion gold
            • Hard and soft wirebondable gold
            • Immersion silver

            Assembly and Test

            • RF assembly of connector, surface mount component, drop-in cavity components, hand and automated solder assembly options
            • RF test center including 6 Network analyzers with combined frequency sweep coverage of 50MHz to 40GHz.
            • Custom anechoic boxes for antenna measurements
            • Switch matrix capability for multiple measurements between human interaction
            大发系统靠谱的平台